Development of Chip

Actual test and implementation of computer started at the end of 1950s. The computer has reached the present stage after going through three major modification stages. Integrated Circuit (IC) was patented by Harwick Johnson of RCA in 1953. Later developments resulted from:

a) the application of photo engraving to IC manufacture.

b) the use of layers of silicon oxide insulation in order to build up multiple layers of crystal circuitry.

The latter of these two methods is often referred to as MOS (Metal Oxide Semiconductor).

Integrated circuits with the equivalent of more than 100 components are called LSI (Large Scale Integration) and those with more than 1000 components are called VLSI (Very Large Scale Integration).

Modern Integrated Circuits (IC) are built on wafer thin slices of extremely purified silicon crystal CHIPS. Development process of chip is a very tedious task. Meticulously the chips are developed under computer control. Development of a chip is summarized in points given below:

1. The high-purity polycrystalline silicon is the raw material used to manufacture integrated circuit chips, the heart of the computer.
2. Under computer control, the chunks are melted in a crucible and slowly draws upward forming cylindrical boule, or crystal.
3. The crystal is sliced into thin wafers and polished to a mirror finish.
4. Using photolithography, complex circuit patterns representing thousands of transistors, diodes, and capacitors are created on the water's surface.
5. Each chip on the water is then electrically tested.
6. The wafers are then diced, or cut into individual chips.
7. The result is an individual chip approximately 5mm square, a marvel of minaturization that forms the electronic building blocks of countless devices that are improving the world in which we live and work.